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Acknowledgment Of Grinding Machine

Aug 01 2006018332Figure 5 Similar maximum surface roughness R y at different feeding depths d f Figure 6 shows SEM photograph of the side view of the silicon wafer left and sinterdAl 2 O 3 right before and after ground Finally we could grind the silicon wafer from 05 mm thickness to 40 m and the sinteredAl 2 O 3 from 1 mm thickness to 40 m by only onestep of grinding in less than 50 min

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